Flexible hybrid interconnect circuits

ABSTRACT

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/667,133, entitled: “FLEXIBLE HYBRID INTERCONNECT CIRCUITS,” filed on2019 Oct. 29, which claims the benefit under 35 U.S.C. § 119(e) of U.S.Provisional Patent Application No. 62/752,019, entitled: “FLEXIBLEHYBRID INTERCONNECT CIRCUITS,” filed on 2018 Oct. 29, both of which areincorporated herein by reference in their entirety for all purposes.

BACKGROUND

Interconnect circuits are used to transmit electrical power and/orsignals from one location to another. Some application examples include,but are not limited to, battery packs (e.g., interconnecting individualbatteries), solar arrays (e.g., interconnecting individual cells in asolar panel), vehicles (e.g., wire harnesses), light fixtures (e.g.,connecting multiple light emitting diodes), various types of electricaland electronic circuits, and the like. While conventional interconnectcircuits can transmit signals, these signals are often limited to directcurrent signals or low frequency signals. The transmission of highfrequency (HF) alternative current signals presents various challenges.For example, HF signal transmission requires precise impedance controlof signal lines. Furthermore, HF signal transmission may causeelectromagnetic interference and crosstalk, which is not desirable.Various conductors and dielectrics surrounding signal lines may absorbHF signals, which is also undesirable and often requires separatecircuits, one for electrical power transmission and another one forsignal transmission.

What is needed are flexible hybrid interconnect circuits capable oftransmitting HF signals and electrical power in the same circuits.

SUMMARY

Provided are flexible hybrid interconnect circuits and methods offorming thereof. A flexible hybrid interconnect circuit comprisesmultiple conductive layers, stacked and spaced apart along the thicknessof the circuit. Each conductive layer comprises one or more conductiveelements, one of which is operable as a HF signal line. Other conductiveelements, in the same and other conductive layers, form anelectromagnetic shield around the HF signal line. Some conductiveelements in the same circuit are used for electrical power transmission.All conductive elements are supported by one or more inner dielectriclayers and enclosed by outer dielectric layers. The overall stack isthin and flexible and may be conformally attached to a non-planarsurface. Each conductive layer may be formed by patterning the samemetallic sheet. Multiple pattern sheets are laminated together withinner and outer dielectric layers to form a flexible hybrid interconnectcircuit.

These and other examples are described further below with reference tothe figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic illustration of an assembly, comprising aflexible hybrid interconnect circuit, operable as a harness, inaccordance with some examples.

FIG. 1B is a schematic cross-sectional view of the flexible hybridinterconnect circuit in FIG. 1A, in accordance with some examples.

FIG. 1C is a schematic cross-sectional view of another example of theflexible hybrid interconnect circuit in FIG. 1A.

FIG. 2A is a schematic cross-sectional view of a signal transmissionportion, separation portion, and a power transmission portion of theflexible hybrid interconnect circuit in FIG. 1A, in accordance with someexamples.

FIG. 2B is an expanded cross-sectional view of an example of the signaltransmission portion in FIG. 2A.

FIG. 2C is an expanded cross-sectional view of the separation portion inFIG. 2A, in accordance with some examples.

FIG. 2D is an expanded cross-sectional view of another example of thesignal transmission portion in FIG. 2A.

FIG. 2E-FIG. 2G are cross-sectional views of different examples of thesignal transmission portion.

FIG. 2H and FIG. 2I are schematic cross-sectional views of twoadditional examples of the signal transmission portion of the flexiblehybrid interconnect circuit.

FIG. 2J is a schematic cross-sectional view of an edge portion of theflexible hybrid interconnect circuit, in accordance with some examples.

FIG. 2K-FIG. 2M are examples of conductive elements for use in signaltransmission portions and/or power transmission portions of flexiblehybrid interconnect circuits.

FIG. 3A illustrates a top view of a conventional circuit with aside-by-side arrangement of conductive elements.

FIG. 3B illustrates a top view of a flexible hybrid interconnect circuitwith a stacked arrangement of conductive elements.

FIG. 3C and FIG. 3D illustrate consistent relative positions ofconductive elements in the flexible hybrid interconnect circuit of FIG.3B.

FIG. 4A-FIG. 4E illustrate different stages and examples of formingconnections to conductive elements of a flexible hybrid interconnectcircuit.

FIGS. 4F-FIG. 4I illustrate additional examples of forming connectionsbetween the conductive elements of a flexible hybrid interconnectcircuit.

FIG. 5A and FIG. 5B illustrate examples of interconnecting conductiveelements using an external interconnecting jumper, extending over theedge of the stack formed by the conductive elements and internaldielectrics.

FIG. 6A and FIG. 6B illustrate examples of interconnecting conductiveelements using conductive elements of an internal conductive tabpositioned between outer dielectric layers.

FIG. 7 illustrates an example of a patterned inner dielectric layerproviding access to a conductive element.

FIG. 8A and FIG. 8B illustrate examples of un-patterned shields in aflexible hybrid interconnect circuit.

FIG. 9A and FIG. 9B illustrate examples of a patterned shield in aflexible hybrid interconnect circuit.

FIG. 10A and FIG. 10B illustrate an example of manufacturing a flexiblehybrid interconnect circuit in a folded state and subsequent unfoldingof the flexible hybrid interconnect circuit during installation of thecircuit, in accordance with some examples.

FIG. 10C illustrates a schematic top view of a flexible hybridinterconnect circuit comprising three openings in the circuit thatdivide the circuit into four circuit strips.

FIG. 10D illustrates a schematic top view of the flexible hybridinterconnect circuit shown in FIG. 10C with one end of the circuitsturned 90° relative to the other end within a plane.

FIG. 10E and FIG. 10F illustrate schematic cross-section views of theinsulator strips of the flexible hybrid interconnect circuit shown inFIG. 10C at different locations.

FIG. 10G illustrates an example of a production assembly comprisingmultiple flexible hybrid interconnect circuits, temporarily joinedtogether.

FIG. 10H illustrates of an example of an interconnect assemblycomprising an interconnect hub and multiple flexible hybrid interconnectcircuits connected to the interconnect hub.

FIG. 10I and FIG. 10J illustrate examples of an interconnect assemblybefore and after attaching an interconnect hub to three flexible hybridinterconnect circuits.

FIG. 10K illustrates a side cross-sectional view of an interconnect hub,mounted to a body panel and connected to a flexible hybrid interconnectcircuit, in accordance with some examples.

FIG. 11A-FIG. 11D illustrate examples of various tabs connected toconductive elements, which form a stack in a flexible hybridinterconnect circuit, with the tabs extending away from that stack.

FIG. 11E and FIG. 11F are top schematic views of a conductive elementwith two portions offset relative to each other and interconnected by atransition portion, in accordance with some examples.

FIG. 12A-FIG. 12C illustrate different examples of electricalconnections, among conductive elements of a flexible hybrid interconnectcircuit, the electrical connection formed using tabs of these conductiveelements.

FIG. 13A is a process flowchart, corresponding to laminating patternedconductive sheets to inner and outer dielectrics, in accordance withsome examples.

FIG. 13B-FIG. 13E are schematic illustrations of various stages duringlamination of the patterned conductive sheets to the inner and outerdielectrics, in accordance with some examples.

FIGS. 14A and 14B are schematic illustrations of two differentelectrical connections provided by a programmable interconnect hub tothe same set of conductive elements of the two flexible hybridinterconnect circuits, in accordance with some examples.

FIG. 14C illustrates of an example of an interconnect assemblycomprising an interconnect hub connected to three flexible hybridinterconnect circuits and a conventional twisted pair cable.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the presented concepts. Thepresented concepts may be practiced without some or all of thesespecific details. In other instances, well known process operations havenot been described in detail so as to not unnecessarily obscure thedescribed concepts. While some concepts will be described in conjunctionwith the specific examples, it will be understood that these examplesare not intended to be limiting. On the contrary, it is intended tocover alternatives, modifications, and equivalents as may be includedwithin the spirit and scope of the present disclosure as defined by theappended claims.

Introduction/Application Examples

Interconnect circuits are used to deliver power and/or signals betweendifferent parts of the circuits. These circuits may be used for variousapplications, such as vehicles, appliances, electronics, and the like.One example of such interconnect circuits is a harness, which typicallyutilizes electrical conductors having round cross-sectional profiles. Ina conventional harness, each electrical conductor may be a solid roundwire or a stranded set of small round wires. A polymer shell insulateseach individual conductor. Furthermore, multiple insulated conductorsmay form a large bundle.

Unfortunately, these conventional harnesses are heavy and can be hard tofeed through narrow spaces because of their substantial thicknessescaused by individual conductors and bundling these conductors.Furthermore, individual electrical conductors have poor thermalconnections to the environment because of their geometries (roundcross-sectional profiles) and arrangements (bundling). In particular,the round cross-sectional profile has the smallest perimeter-to-arearatio among all possible shapes. As a result, conventional harnessesexperience poor heat dissipation during their operation and requirewires with large cross-sections, all of which add to the weight, size,and cost of these harnesses. Finally, round wires are generally notcapable of transmitting HF signals without expensive shieldingmaterials.

These deficiencies of conventional harnesses and other like circuits areaddressed with flexible hybrid interconnect circuits, described herein.A flexible hybrid interconnect comprises two outer dielectrics and asignal transmission portion, disposed between the outer dielectrics. Thesignal transmission portion is formed by multiple conductive elements,one of which is operable as a signal line. The signal line may bedisposed between two or more shields, at least two of which are offsetrelative to the signal line along the width of the flexible hybridinterconnect circuit. Furthermore, additional shields may be used (e.g.,the signal line may be disposed between two other shields, offsetrelative to the signal line along the width of the flexible hybridinterconnect circuit). All of these conductive elements are supportedwith respect to each other by one or more inner dielectrics and, in someexample, by outer dielectrics, which also seal the conductive elementsfrom the environment.

In some examples, the flexible hybrid interconnect circuit alsocomprises a power transmission portion. The power transmission portionmay be offset relative to the signal transmission portion along thewidth of the flexible hybrid interconnect circuit to reduceelectromagnetic interference. The number of conductive layers in thepower transmission portion is the same as the number of conductivelayers in the signal transmission portion.

Unlike conventional wire harnesses, the flexible hybrid interconnectcircuit has a low thickness profile, which is determined by thethickness of all conductive layers as well as inner and outerdielectrics. Furthermore, the thickness of the flexible hybridinterconnect circuit is constant. In some examples, the thickness of theflexible hybrid interconnect circuit is less than five millimeters oreven less than one millimeter, which is substantially smaller than thethickness of a conventional bundled harness. Such a small thickness isachieved by using thin conductive elements. The conductivity (e.g., inthe power transmission portion) is achieved by using wide conductiveelements. Furthermore, a combination of the small thickness and largewidth allows achieving good thermal contact with the environment (e.g.,when the flexible hybrid interconnect circuit is adhered to and conformsto a heat sink, such as a vehicle body panel). This thickness-widthfeature allows stacking multiple conductive elements in two directions(the thickness direction and the width direction).

In some examples, the aspect ratio (the ratio of the width to thethickness) of the flexible hybrid interconnect circuit is more thanthree or even more than ten. In other words, the flexible hybridinterconnect circuit may have a thin and flat cross-sectional profile(i.e., within the cross-sectional plane perpendicular to the length ofthe flexible hybrid interconnect circuit). This aspect allowsmaintaining flexibility and conforming the flexible hybrid interconnectcircuit to various non-planar surfaces while also providing thermalcoupling to these surfaces. In some examples, one of the outerdielectrics comprises an adhesive layer for attaching to supportingstructures, which may also be operable as heat sinks or heat spreaders.

FIG. 1A is a schematic illustration of assembly 200, comprising flexiblehybrid interconnect circuit 100 attached to body panel 210. While bodypanel 210 is shown as a car door, one having ordinary skill in the artwould understand that various other types of vehicle panels (e.g., roof)and types of vehicles (e.g., aircraft, watercraft) are also within thescope. Furthermore, flexible hybrid interconnect circuit 100 may be apart of or attached to other types of structures, such as batteryhousing, appliances (e.g., refrigerators, washers/dryers, heating,ventilation, and air conditioning), aircraft wiring, and the like. Itshould be noted that body panel 210 may be operable as a heat sink orheat spreader.

Returning to the example shown in FIG. 1A, flexible hybrid interconnectcircuit 100 may be adhered to and supported by body panel 210. Forexample, flexible hybrid interconnect circuit 100 may comprise anadhesive (e.g., a thermally conductive adhesive) for attaching to bodypanel 210, as further described below. The flexibility of flexiblehybrid interconnect circuit 100 is achieved by its small thickness andlarge aspect ratio. This flexibility allows flexible hybrid interconnectcircuit 100 to conform and adhere to various non-planar portions of bodypanel 210. Maximizing the contact interface between flexible hybridinterconnect circuit 100 and body panel 210 provides greater support andmore heat dissipation from flexible hybrid interconnect circuit 100 tobody panel 210. The attachment between flexible hybrid interconnectcircuit 100 and body panel 210 is further illustrated in FIG. 1B anddescribed below. In addition to functioning as a thermal mass/heatspreader for flexible hybrid interconnect circuit 100, body panel 210may provide electromagnetic shielding (e.g., when body panel 210 ismetal and positioned sufficiently close to the signal line of flexiblehybrid interconnect circuit 100).

Referring to FIG. 1A, in some examples, flexible hybrid interconnectcircuit 100 comprises one or more connectors 105 a-105 c for connectingto various electrical devices 220. Some examples of electrical devices220 include, but are not limited to, speakers, lights, door locks,window regulators, power mirrors, and the like. In some examples,flexible hybrid interconnect circuit 100 comprises conventional printedcircuit structures used for transmitting data, including but not limitedto, striplines, microstrips, and/or coplanar waveguides.

Examples of Flexible Hybrid Interconnect Circuits

FIG. 1B is a schematic cross-sectional view of flexible hybridinterconnect circuit 100 in FIG. 1A and identifies, in general, thewidth (extending along the X-axis), thickness (along the Y-axis), andlength (along Z-axis). One having ordinary skill in the art wouldunderstand that flexible hybrid interconnect circuit 100 will change itsorientation due to its flexibility. Specifically, flexible hybridinterconnect circuit 100 may bend around any one of the identified axesduring its production, handling, installation and/or operation, and theorientation of the width, thickness, and length may change and may bedifferent at different locations of flexible hybrid interconnect circuit100.

Referring to FIG. 1B, flexible hybrid interconnect circuit 100 comprisesfirst outer dielectric 110 and second outer dielectric 120, whichcollectively seal various internal components of flexible hybridinterconnect circuit 100. Furthermore, FIG. 1B illustrates flexiblehybrid interconnect circuit 100 comprising signal transmission portion130 and power transmission portion 190. In some examples, powertransmission portion 190 is absent. Signal transmission portion 130 andpower transmission portion 190 are disposed between first outerdielectric 110 and second outer dielectric 120. Together with othercomponents of flexible hybrid interconnect circuit 100, such as innerdielectrics further described below, first outer dielectric 110 andsecond outer dielectric 120 also support conductive elements 350 (shownin FIG. 10E) of signal transmission portion 130 and power transmissionportion 190.

In some examples, flexible hybrid interconnect circuit 100 has multiplesignal transmission portions, such as signal transmission portion 130and additional signal transmission portion 131 shown in FIG. 1B.Multiple signal transmission portions are offset relative to each otheralong the width of flexible hybrid interconnect circuit 100. FIG. 1Billustrates an example in which signal transmission portion 130 andadditional signal transmission portion 131 are separated by powertransmission portion 190.

When power transmission portion 190 is present, power transmissionportion 190 is offset relative to signal transmission portion 130 alongthe width of flexible hybrid interconnect circuit 100 (the X directionin FIG. 1B). Similar to signal transmission portion 130, powertransmission portion 190 may comprise multiple conductive elementsarranged into conductive layers. In some examples, the number ofconductive layers in signal transmission portion 130 is the same as inpower transmission portion 190, e.g., three conductive layers, as shownin FIG. 1B, forming a stack along the thickness. Alternatively,different numbers of conductive layers may be used. For example,conductive elements in power transmission portion 190 do not requireelectromagnetic shielding. As a result, power transmission portion 190may have fewer conductive layers (e.g., one or two). In some examples,signal transmission portion 130 requires only one sided shielding, andonly two conductive layers are used to form all conductive elements ofsignal transmission portion 130. Additional shielding may be provided,for example, by an external structure, such as body panel 210 in FIG.1B.

Flexible hybrid interconnect circuit 100 may be attached to body panel210 (or any other like supporting structure or heat sink) using adhesivelayer 121 or, more specifically, a thermally conductive adhesive layer.It should be noted that while adhesive layer 121 is a part flexiblehybrid interconnect circuit 100, body panel 210 (or any other likesupporting structure or a heat sink) is not be a part of flexible hybridinterconnect circuit 100.

Referring to FIG. 1C, flexible hybrid interconnect circuit 100 comprisesone or more inner dielectrics, such as first inner dielectric 160 andsecond inner dielectric 170. During fabrication of flexible hybridinterconnect circuit 100, first inner dielectric 160 and second innerdielectric 170 may be combined (e.g., laminated) into inner dielectric165. The boundaries of first inner dielectric 160 and second innerdielectric 170 may or may not be distinguishable in inner dielectric165. Alternatively, in some examples, fabrication of flexible hybridinterconnect circuit 100 involves using a single inner dielectric 165.

First inner dielectric 160 and second inner dielectric 170 provideinsulation and support to different conductive elements. Additionalinsulation and support is provided by first outer dielectric 110 andsecond outer dielectric 120. First inner dielectric 160 and second innerdielectric 170 may extend to edge 102 of flexible hybrid interconnectcircuit 100 as, for example, shown in FIG. 1C. As such, edge 102 may beformed by first outer dielectric 110, second outer dielectric 120, firstinner dielectric 160, and second inner dielectric 170. However,conductive elements do not extend to edge 102 (other than to formexternal connections) to ensure electrical isolation of these elements.

In this example, first outer dielectric 110 and second outer dielectric120 require less bending and are less prone to leave unfilled gaps inthe sealed space, which may be referred to as “soda straw” defects.These gaps may allow moisture penetration and migration within flexiblehybrid interconnect circuit 100. Edge 102 may be formed by“kiss-cutting” or other like techniques. Without being restricted to anyparticular theory, it is believed that some of these edge-formingtechniques may cause intermixing of first inner dielectric 160 andsecond inner dielectric 170 at least along edge 102, thereby causingmore effective sealing. Alternatively, first outer dielectric 110directly interfaces second outer dielectric 120 at an edge and formsedge 102 as, for example, shown in FIG. 1B. In some examples, one ormore conductive elements protrude to or beyond edge 102.

Referring to FIG. 2A, signal transmission portion 130 comprises multipleconductive elements arranged into two or more conductive layers. Theselayers are stacked along the thickness of flexible hybrid interconnectcircuit 100 (the Y-axis). Power transmission portion 190, when one ispresent, comprises one or more conductive elements arranged into one ormore conductive layers. FIG. 2A shows three conductive layers in each ofsignal transmission portion 130 and power transmission portion 190.However, other numbers of conductive layers in each portion is withinthe scope.

Referring to FIG. 2A, signal transmission portion 130 comprises signalline 132 and one or more optional shields, such as first shield 134,second shield 136, third shield 138, and fourth shield 139. Each one ofthese components may be referred to as a conductive element. In thisexample, third shield 138 forms one conductive layer. Second shield 136,signal line 132, and third shield 138 form another conductive layer.Fourth shield 139 forms yet another conductive layer. In other words,the example of signal transmission portion 130 in FIG. 2A has threeconductive layers. However, any other number of conductive layers may beused. For example, FIG. 2E illustrates an example of signal transmissionportion 130, which does not have third shield 138. In other words,signal line 132 is only shielded along the Y-axis in one direction byfourth shield 139. FIG. 2F illustrates another example of signaltransmission portion 130, which may be referred to as a microstrip. Inthis example, signal line 132 is only shielded along the Y-axis, andonly in one direction, by fourth shield 139. There is no shielding alongthe X-axis. Other examples are coplanar waveguides (no shields) andstriplines (shields on both sides). FIG. 2G illustrates yet anotherexample of signal transmission portion 130, which has four conductivelayers. In addition to signal line 132, first shield 134, second shield136, third shield 138, and fourth shield 139, which form three layers,this signal transmission portion 130 also comprises overpass conductiveelement 137.

Signal line 132 is configured to carry HF signals, while one or more offirst shield 134, second shield 136, third shield 138, and fourth shield139 form an electromagnetic shield around signal line 132. Specifically,these shields prevent interference from external electromagnetic noise.These shields also prevent signal line 132 from radiating to the outsideenvironment (e.g., causing electromagnetic noises).

Referring to the example in FIG. 2A, signal line 132 is disposed betweenfirst shield 134 and second shield 136, along the width of flexiblehybrid interconnect circuit 100 (along the X-axis). Signal line 132 isalso disposed between third shield 138 and fourth shield 139, alongthickness of flexible hybrid interconnect circuit 100 (along theY-axis). This example may be referred to as four-sided shielding or anenclosed shielding. Furthermore, in this example, each of third shield138 and fourth shield 139 overlaps with each of first shield 134 andsecond shield 136 along the width of flexible hybrid interconnectcircuit 100 (along the X-axis). The spacing between first shield 134 andeach of third shield 138 and fourth shield 139 (and, similarly, betweensecond shield 136 and each of third shield 138 and fourth shield 139) issufficiently small to prevent penetration of electromagnetic waves.

Referring to the example in FIG. 2A, each of signal line 132 and one ormore shields (e.g., first shield 134, second shield 136, third shield138 and fourth shield 139) has a substantially rectangularcross-sectional profile, within a plane perpendicular to the length offlexible hybrid interconnect circuit 100. The rectangular profile may bea result of forming these components from the metal sheets (e.g.,patterning metal foils as further described below). Specifically, eachconductive layer may be formed from a separate metal sheet. Thus, signalline 132, first shield 134, and second shield 136 are formed from thesame sheet. Furthermore, the thickness of all conductive elements in thesame conductive layer may be the same (e.g., being formed from the samemetal sheet).

In some examples, the aspect ratio (the ratio of the width to thethickness) of at least one of signal line 132, first shield 134, secondshield 136, third shield 138, and fourth shield 139 is at least about 2,at least about 5, or even at least about 10. The high aspect ratioenhances thermal conductivity to heat sinks (e.g., body panel 210 inFIG. 1B) by increasing the interface area, while also keeping arelatively low thickness of flexible hybrid interconnect circuit 100.

Referring to FIG. 2A, the size of the gap between signal line 132 andthird shield 138 along the thickness of flexible hybrid interconnectcircuit 100 (the Y-axis) may be less than 0.8 millimeters or, morespecifically, less than 0.6 millimeters or even less than 0.4millimeters. Furthermore, the size of the gap between signal line 132and fourth shield 139, the gap between second shield 136 and thirdshield 138, and the gap between second shield 136 and fourth shield 139may also be within this range. These gaps allow blocking external andinternal electromagnetic fields when signal line 132 is operated at afrequency of between about 0 Hz and 100 GHz. Overall, the gaps aresmaller than the wavelength of incident waves of electromagnetic fieldscaused by transmission of a radio frequency (RF) signal in signal line132. As such, one or more of first shield 134, second shield 136, thirdshield 138, and fourth shield 139 effectively form a Faraday cage aroundsignal line 132.

The size of the gap between first shield 134 and third shield 138depends on the thickness and materials of first inner dielectric 160 andprocessing conditions used to laminate these components while formingflexible hybrid interconnect circuit 100, as further explained below. Ina similar manner, the size of the gap between first shield 134 andfourth shield 139 depends on the size and materials of second innerdielectric 170 and processing conditions used to laminate thesecomponents. Referring to FIG. 2A, first inner dielectric 160 may atleast partially extend between first shield 134 and third shield 138 aswell as between signal line 132 and third shield 138 and between secondshield 136 and third shield 138. As such, the size of the gap betweenfirst shield 134 and third shield 138 as well as between signal line 132and third shield 138 and between second shield 136 and third shield 138may be substantially the same (e.g., to within a variation of less than20% or even less than 10%). Similarly, second inner dielectric 170 mayextend between first shield 134 and fourth shield 139 as well as betweensignal line 132 and fourth shield 139 and between second shield 136 andfourth shield 139. As such, the size of the gap between first shield 134and fourth shield 139 as well as between signal line 132 and fourthshield 139 and between second shield 136 and fourth shield 139 may besubstantially the same. Furthermore, the gap between first shield 134and third shield 138 may be substantially the same as the gap betweenfirst shield 134 and fourth shield 139. For example, both first innerdielectric 160 and second inner dielectric 170 may have the samethickness and material. The precise control of the gap achieved by firstinner dielectric 160 and second inner dielectric 170 allows precisecontrol of the impedance of flexible hybrid interconnect circuit 100,which is inversely proportional to the capacitance.

In some examples, signal line 132 is electrically insulated from each offirst shield 134, second shield 136, third shield 138, and fourth shield139. This insulation prevents signal loss when an HF signal istransferred through signal line 132. Optionally, two or more (e.g., all)of first shield 134, second shield 136, third shield 138, and fourthshield 139 may be interconnected. The interconnection allows forming onecommon external connection to all shields (e.g., for grounding).Furthermore, unconnected (“floating”) shields may be susceptible tocapacitive coupling among each other and can also capacitively couple tosignal line 132. Various examples of these connections are describedbelow.

In some examples, the thickness of each of signal line 132, first shield134, and second shield 136 along a thickness of flexible hybridinterconnect circuit 100 is the same. Furthermore, the composition ofeach of signal line 132, first shield 134, and second shield 136 may bethe same. For example, signal line 132, first shield 134, and secondshield 136 may be made from the same metal sheet. More generally, eachconductive layer of flexible hybrid interconnect circuit 100 may be madefrom the same metal sheet.

FIG. 2H and FIG. 2I are schematic cross-sectional views of twoadditional examples of signal transmission portion 130. In each of theseexamples, signal transmission portion 130 comprises first signal line132 and second signal line 133, both disposed between third shield 138and fourth shield 139. These signal lines and shields form a stack alongthe Y direction. The terms “third” and “fourth” are used for consistencywith previous examples and do not imply presence of other components.Third shield 138 and fourth shield 139 may be referred to as top andbottom shields, without limiting the orientation of signal transmissionportion 130.

First signal line 132 and second signal line 133 are offset relative toeach other along the X direction. However, unlike various examplesdescribed above with reference to FIG. 2A, signal transmission portion130 shown in FIG. 2H and FIG. 2I does not have side shields. In otherwords, there are no shields offset relative to first signal line 132 andsecond signal line 133 in the X direction. The “side” shielding featuresmay not be necessary when the spacing between each of first signal line132 and second signal line 133 and each of third shield 138 and fourthshield 139 is substantially less (e.g., 2× or even 10×) than thewavelength of signals carried by first signal line 132 and second signalline 133.

Referring to FIG. 2H, the right ends of first signal line 132, thirdshield 138, and fourth shield 139 are aligned (along the Y axis).Similarly, the left ends of second signal line 133, third shield 138,and fourth shield 139 are aligned (along the Y axis). This featurereduces the overall footprint of signal transmission portion 130 (alongthe X axis), making it more compact.

Referring to FIG. 2I, the right ends of third shield 138 and fourthshield 139 extend to the right (along the X axis) past the right end offirst signal line 132. Similarly, the left ends of third shield 138 andfourth shield 139 extend to the left (along the X axis) past the leftend of second signal line 133. This design provides additional shieldingby positioning first signal line 132 and second signal line 133 deeperinside the space between third shield 138 and fourth shield 139 and awayfrom the side openings to this space, therefore reducing the risk ofelectro-magnetic interference.

FIG. 2J illustrates a portion of interconnect circuit 100 near edge 102of interconnect circuit 100. Conductive element 350 is surrounded byinner dielectric 165. Furthermore, conductive element 350 is positionedat a first distance (D1) from surface 167 of inner dielectric 165 and ata second distance (D2) from edge 102. The first distance (D1) and thesecond distance (D2) are selected such that inner dielectric 165 doesnot experience dielectric breakdown when a signal or an electrical poweris transmitted through conductive element 350. In some example, thefirst distance (D1) is at least 50 micrometers or, more specifically, atleast 100 micrometers. In the same or other examples, the seconddistance (D2) is at least 100 micrometers or, more specifically, atleast 200 micrometers. The first distance (D1) may be smaller than thesecond distance (D2) because surface 167 of inner dielectric 165 furtherinterfaces with first outer dielectric 110, which provides additionalelectrical isolation to conductive element 350 from the environment.Likewise, the opposite surface of inner dielectric 165 interfaces withsecond outer dielectric 120, which provides additional electricalisolation.

In some examples, one or more conductive elements of flexible hybridinterconnect circuit 100 comprise a base sublayer and a surface sublayeras, for example, shown in FIGS. 2K-FIG. 2M. The base and surfacesublayers have different compositions and server different functions.Referring to FIG. 2K, conductive element 350 comprises base sublayer1002 and surface sublayer 1006, directly interfacing base sublayer 1002.First inner dielectric 160 and/or second inner dielectric 170 may belaminated over surface sublayer 1006. More specifically, at least aportion of surface sublayer 1006 may directly interface first innerdielectric 160 and/or second inner dielectric 170 (or an adhesive usedfor attaching these dielectrics). Surface sublayer 1006 may bespecifically selected to improve adhesion of first inner dielectric 160and/or second inner dielectric 170.

Base sublayer 1002 may comprise a metal selected from a group consistingof aluminum, titanium, nickel, copper, and steel, and alloys comprisingthese metals. The material of base sublayer 1002 may be selected toachieve desired electrical and thermal conductivities of conductiveelement 350 (or another conductive element) while maintaining minimalcost.

Surface sublayer 1006 may comprise a metal selected from the groupconsisting of tin, lead, zinc, nickel, silver, palladium, platinum,gold, indium, tungsten, molybdenum, chrome, copper, alloys thereof,organic solderability preservative (OSP), or other electricallyconductive materials. The material of surface sublayer 1006 may beselected to protect base sublayer 1002 from oxidation, improve surfaceconductivity when forming an electrical and/or thermal contact to adevice, improve adhesion to conductive element 350 (or anotherconductive element), and/or other purposes. Furthermore, in someexamples, the addition of a coating of OSP on top of surface sublayer1006 may help prevent surface sublayer 1006 itself from oxidizing overtime.

For example, aluminum may be used for base sublayer 1002. While aluminumhas a good thermal and electrical conductivity, it forms a surface oxidewhen exposed to air. Aluminum oxide has poor electrical conductivity andmay not be desirable at the interface between conductive element 350 andother components making an electrical connection to conductive element350. In addition, in the absence of a suitable surface sublayer,achieving good, uniform adhesion between the surface oxide of aluminumand many adhesive layers may be challenging. Therefore, coating aluminumwith one of tin, lead, zinc, nickel, silver, palladium, platinum, gold,indium, tungsten, molybdenum, chrome, or copper before aluminum oxide isformed mitigates this problem and allows using aluminum as base sublayer1002 without compromising electrical conductivity or adhesion betweenconductive element 350 (or another conductive element) and othercomponents of flexible hybrid interconnect circuit 100.

Surface sublayer 1006 may have a thickness of between about 0.01micrometers and 10 micrometers or, more specifically, between about 0.1micrometers and 1 micrometer. For comparison, a thickness of basesublayer 1002 may be between about 10 micrometers and 1000 micrometersor, more specifically, between about 100 micrometers and 500micrometers. As such, base sublayer 1002 may represent at least about90% or, more specifically, at least about 95% or even at least about 99%of conductive element 350 (or another conductive element) by volume.

In some examples, conductive element 350 (or another conductive element)further comprises one or more intermediate sublayers 1004 disposedbetween base sublayer 1002 and surface sublayer 1006 as shown, forexample, in FIG. 2L. Intermediate sublayer 1004 has a differentcomposition than base sublayer 1002 and surface sublayer 1006. In someexamples, the one or more intermediate sublayers 1004 may help preventintermetallic formation between base sublayer 1002 and surface sublayer1006. For example, intermediate sublayer 1004 may comprise a metalselected from a group consisting of chromium, titanium, nickel,vanadium, zinc, and copper.

In some examples, conductive element 350 (or another conductive element)may comprise rolled metal foil. In contrast to the vertical grainstructure associated with electrodeposited foil and/or plated metal, thehorizontally-elongated grain structure of rolled metal foil may helpincrease the resistance to crack propagation in conductive elementsunder cyclical loading conditions. This may help increase the fatiguelife of flexible hybrid interconnect circuit 100.

In some examples, conductive element 350 (or another conductive element)comprises electrically insulating coating 1008, which forms surface 1009of conductive element 350, disposed opposite of conductive surface 1007as shown, for example, in FIG. 2M. At least a portion of this surface1009 may remain exposed in flexible hybrid interconnect circuit 100 andmay be used for heat removal from flexible hybrid interconnect circuit100. In some examples, the entire surface 1009 remains exposed inflexible hybrid interconnect circuit 100. Insulating coating 1008 may beselected for relatively high thermal conductivity and relatively highelectrical resistivity and may comprise a material selected from a groupconsisting of silicon dioxide, silicon nitride, anodized alumina,aluminum oxide, boron nitride, aluminum nitride, diamond, and siliconcarbide. Alternatively, insulating coating may comprise a compositematerial such as a polymer matrix loaded with thermally conductive,electrically insulating inorganic particles.

In some examples, a conductive element is solderable. When a conductiveelement includes aluminum, the aluminum may be positioned as basesublayer 1002, while surface sublayer 1006 may be made from a materialhaving a melting temperature that is above the melting temperature ofthe solder. Otherwise, if surface sublayer 1006 melts during circuitbonding, oxygen may penetrate through surface sublayer 1006 and oxidizealuminum within base sublayer 1002. This in turn may reduce theconductivity at the interface of the two sublayers and potentially causea loss of mechanical adhesion. Hence, for many solders that are appliedat temperatures ranging from 150-300° C., surface sublayer 1006 may beformed from zinc, silver, palladium, platinum, copper, nickel, chrome,tungsten, molybdenum, or gold. In some examples, e.g., in cases in whicha high frequency signal is to be transmitted down the signal line, thesurface sublayer composition and thickness may be chosen in orderminimize resistance losses due to the skin effect.

Referring to FIG. 2A, flexible hybrid interconnect circuit 100 furthercomprises power transmission portion 190. Similar to signal transmissionportion 130, power transmission portion 190 is disposed between firstouter dielectric 110 and second outer dielectric 120. Furthermore, powertransmission portion 190 is offset relative to signal transmissionportion 130 along the width of flexible hybrid interconnect circuit 100(along the X-axis in FIG. 2A). The distance between power transmissionportion 190 and signal transmission portion 130 may be referred to asseparation portion 195. The width of separation portion 195 may be atleast 2 times the width of signal line 132 or, more specifically, atleast 4 times or even at least 6 times.

Referring to the example in FIG. 2A, power transmission portion 190 isformed from three conductive layers and comprises three conductiveelements, which may be referred to as first power conductor 192, secondpower conductor 194, and third power conductor 196. However, two ofthese power conductors are optional. In other words, power transmissionportion 190 may have any number of power conductors, i.e., one, two,three, four, and so forth. When two or more power conductors are presentand stacked along the thickness of flexible hybrid interconnect circuit100 (along the Y-axis in FIG. 2A), all of these conductors may be usedfor power transmission. Alternatively, one or more may be used asshields or not present at all.

Referring to the example in FIG. 2A, third power conductor 196 isdisposed between first power conductor 192 and second power conductor194 along the thickness of flexible hybrid interconnect circuit 100,thereby forming a stack (along the Y-axis in FIG. 2A). First innerdielectric 160 may be disposed between first power conductor 192 andthird power conductor 196 and used to support first power conductor 192and third power conductor 196 relative to each other. Similarly, secondinner dielectric 170 may be disposed between second power conductor 194and third power conductor 196 and used to support second power conductor194 and third power conductor 196 relative to each other.

The size of the gap between first power conductor 192 and third powerconductor 196 depends on the thickness and materials of first innerdielectric 160 and processing conditions used to laminate thesecomponents while forming flexible hybrid interconnect circuit 100, asfurther explained below. In a similar manner, the size of the gapbetween second power conductor 194 and third power conductor 196 dependson the size and materials of second inner dielectric 170 and processingconditions used to laminate these components. The gap between firstpower conductor 192 and third power conductor 196 may be substantiallythe same as the gap between second power conductor 194 and third powerconductor 196. As noted above, in some examples, both first innerdielectric 160 and second inner dielectric 170 may have the samethickness and material.

The stack formed by first power conductor 192, second power conductor194, and third power conductor 196 may be similar to the stack formed bythird shield 138, signal line 132, and fourth shield 139. In someexamples, third shield 138 and first power conductor 192 may be formedfrom the same metal sheet. Similarly, signal line 132 and third powerconductor 196 may be formed from the same metal sheet. Finally, secondpower conductor 194 and fourth shield 139 may be formed from the samemetal sheet.

Stacking first power conductor 192, second power conductor 194, andthird power conductor 196 along the thickness of flexible hybridinterconnect circuit 100 eliminates the problem of crossing conductorswhile routing flexible hybrid interconnect circuit 100, as will now beexplained with reference to FIGS. 3A-3D.

FIG. 3A illustrates a top view of reference circuit 100 with aside-by-side arrangement of its conductive elements, i.e., firstconductive element 350 and second conductive element 360. When referencecircuit 300 is routed as shown in FIG. 3A, the relative orientation offirst conductive element 350 and second conductive element 360 isflipped between first end 101 and second end 103. Specifically, at firstend 101, first conductive element 350 is shifted upward along the Z axisrelative to second conductive element 360. On the other hand, at secondend 103, first conductive element 350 is shifted downward along the Zaxis relative to second conductive element 360. This orientation changemay be referred to as a “cross-over.”

FIG. 3B illustrates a top view of flexible hybrid interconnect circuit100 with a stacked arrangement of conductive elements. Referring toFIGS. 3C and 3D, first conductive element 350 is shifted upward alongthe Y axis relative to second conductive element 360 at both first end101 and second end 103. This orientation of first conductive element 350and second conductive element 360 for any routing of flexible hybridinterconnect circuit 100 within X-Z plane, including our of planedeviations.

Dielectric Examples

Returning to FIG. 2A, flexible hybrid interconnect circuit 100 comprisesfirst inner dielectric 160 and second inner dielectric 170. First innerdielectric 160 is disposed between signal line 132 and third shield 138as well as between first shield 134 and third shield 138 and betweensecond shield 136 and third shield 138. First inner dielectric 160provides support to these components of flexible hybrid interconnectcircuit 100. Furthermore, first inner dielectric 160 ensures that signalline 132 is electrically insulated from third shield 138, first shield134, and second shield 136 by maintaining relative positions of theseshields during operation of flexible hybrid interconnect circuit 100.

Second inner dielectric 170 is disposed between signal line 132 andfourth shield 139 as well as between first shield 134 and fourth shield139 and between second shield 136 and fourth shield 139. Similar tofirst inner dielectric 160, second inner dielectric 170 providessupports to these components of flexible hybrid interconnect circuit100. Furthermore, second inner dielectric 170 ensures that signal line132 is electrically insulated from fourth shield 139, first shield 134,and second shield 136 by maintaining their relative positions.

Generally, a thicker inner dielectric layer (e.g., first innerdielectric 160 and second inner dielectric 170) results in a lowercapacitance. This, in turn, allows forming a wider signal line 132 whilestill matching the overall capacitance per unit length with the rest offlexible hybrid interconnect circuit 100. When signal line 132 is wider,there are lower resistive losses of the signal and provides better HFperformance.

First inner dielectric 160 and/or second inner dielectric 170 may beformed from one or more materials having a dielectric constant less than2 or even less than 1.5. In some examples, these materials are closedcell foams. Furthermore, first inner dielectric 160 and/or second innerdielectric 170 may be formed from one or more materials that do notabsorb water.

In some examples, at least one of first inner dielectric 160 and secondinner dielectric 170 comprises or consists essentially of crosslinkedpolyethylene (XLPE). More specifically, both first inner dielectric 160and second inner dielectric 170 comprise or consist essentially ofcrosslinked XLPE. For purposes of this disclosure, the term “consistingessentially” is defined as a composition of at least about 95% byweight. In some examples, the crosslinked XLPE, used for first innerdielectric 160 and/or second inner dielectric 170, is highly crosslinkedXLPE, in which the degree of cross-linking is at least about 40%, atleast about 70%, or even at least about 80%. Crosslinking preventsflowing/movement of first inner dielectric 160 and/or second innerdielectric 170 within the operating temperature range of flexible hybridinterconnect circuit 100, which may be between about −40° C. (−40° F.)to +105° C. (+220° F.). This lack of flow prevents shorts between signalline 132, shields, and/or other conductive elements of flexible hybridinterconnect circuit 100. Furthermore, crosslinking prevents oozing offirst inner dielectric 160 and second inner dielectric 170 from edgesand openings of flexible hybrid interconnect circuit 100.

Conventional flexible circuits do not use XLPE primarily because ofvarious difficulties with patterning conductive elements (by etching)against the backing formed from XLPE. XLPE is not sufficiently robust towithstand conventional etching techniques.

In some examples, the materials of first outer dielectric 110, secondouter dielectric 120, first inner dielectric 160, and/or second innerdielectric 170 are specifically selected to enhance flexibility offlexible hybrid interconnect circuit 100. Some suitable examples arepolyolefins, which are predominantly linear polymers (as compared topolyesters, which contain an aromatic ring and therefore are lessflexible). In particular, silane-modified polyolefins may be used forone or both inner dielectric layers. Some specific combinations includea modified polypropylene for one or both outer dielectric layers and amodified linear low-density polyethylene (LLDPE) for one or both innerdielectric layers. In other examples, a modified polypropylene may beused for all inner and outer dielectric layers. In yet another example,a co-extruded material comprising a modified LLDPE and a modifiedpolypropylene may be used for at least one of inner and outer dielectriclayers. In general, a coextruded film comprising a combination of ahigh-melt polymer and a low-melt polymer may be used for flexible hybridinterconnect circuit 100. The high-melt polymer may function as an outerdielectric, while the low-melt polymer may function as an innerdielectric and used for gap fill between conductive leads.

In some examples, a thermoplastic polyurethane (TPU) or, morespecifically, a polyurethane ether may be used as one or both of outerdielectrics. The flexibility of polyurethanes can be tuned by usingappropriate chemistry. Furthermore, one or more fire retardants (e.g.,non-halogenated fire retardants) may be incorporated into one or both ofouter dielectric layers. Various examples of fire retardants aredescribed below.

In some examples, first outer dielectric 110, second outer dielectric120, first inner dielectric 160, and/or second inner dielectric 170comprise one or more transparent materials, e.g., one or moreelastomeric polymers, such as ethylene-butylene copolymers,plasticizer-compounded polyolefins, and the like.

In some examples, at least one of the dielectrics comprises a flameretardant, e.g., phosphorus, organophosphorus, and the like. The flameretardant may be added, e.g., as particles, into polymer matrix, variousexamples of which are listed above. Alternatively, a flame retardant maybe in the form of a standalone structure, e.g., a flame retardant paperor a flame barrier. More specifically, one of first outer dielectric 110or second outer dielectric 120 is polyethylene naphthalate (PEN), whilethe other one is a flame retardant paper. It should be noted thatconventional circuits (formed by etching and other like processes) arenot able to use flame barriers for their dielectric layers. In someexamples, polyimide (PI) may be used for one or more dielectric layers,in addition or instead of flame retardants because of its inherentcombustion resistant properties.

In some examples, first outer dielectric 110 and/or second outerdielectric 120 comprises a coefficient of thermal expansion(CTE)-matching additive. The composition and concentration of theCTE-matching additive in these dielectric layers is specificallyselected to match that of conductive elements or, more specifically, acombination of the conductive elements and/or or more inner dielectrics.It should be noted that flexible hybrid interconnect circuit 100 may besubjected to temperature fluctuations during its manufacturing (e.g.,one or more lamination operations described below) and/or operation(e.g., operating in an engine bay of a vehicle). For example, one orboth of first outer dielectric 110 and second outer dielectric 120comprises a polymer matrix, comprising polyethylene terephthalate (PET)and/or polyethylene naphthalate (PEN), and a CTE-matching additive,distributed within this matrix and comprising inorganic fillers, such asglass fibers, and mica/silica. The CTE-matching additive may be in theform particles having a low aspect ratio (e.g., less than 0.5) or havinga high aspect ratio (e.g., greater than 1). The concentration of theCTE-matching additive in one or both of first outer dielectric 110 andsecond outer dielectric 120 is between 10% by weight and 50% by weight.While high concentrations of the CTE-matching additive may help toreduce the CTE mismatch, the flexibility of these dielectrics may sufferfrom excessive amounts of the CTE-matching additive.

Referring to FIG. 2B, in some examples, the composition of first innerdielectric 160 is uniform throughout its thickness (the Y direction).Likewise, the composition of second inner dielectric 170 may be uniformthroughout its thickness. Alternatively, in another example presented inFIG. 2D, first inner dielectric 160 comprises first inner base 162,first inner outer-facing adhesive 164, and first inner inner-facingadhesive 166. In this example, first inner base 162 is disposed betweenfirst inner outer-facing adhesive 164 and first inner inner-facingadhesive 166, along the thickness of flexible hybrid interconnectcircuit 100. The composition of first inner base 162 differs from thecomposition of first inner outer-facing adhesive 164 and from thecomposition of first inner inner-facing adhesive 166. The compositionsof first inner outer-facing adhesive 164 and first inner inner-facingadhesive 166 may be the same. For example, first inner base 162 maycomprise polyethylene terephthalate (PET), polyimide (PI), orpolyethylene naphthalate (PEN). One or both of first inner outer-facingadhesive 164 and first inner inner-facing adhesive 166 may comprise anadhesive material including but not limited to XDPE, low-densitypolyethylene (LDPE), polyester (PET), acrylic, ethyl vinyl acetate(EVA), epoxy, pressure sensitive adhesives, or the like.

In this example, the structure of second inner dielectric 170 is thesame as the structure of first inner dielectric 160. Specifically,second inner dielectric 170 comprises second inner base 172, secondinner outer-facing adhesive 174, and second inner inner-facing adhesive176. Second inner base 172 is disposed between second inner outer-facingadhesive 174 and second inner inner-facing adhesive 176, along thethickness of flexible hybrid interconnect circuit 100. In otherexamples, the structure of second inner dielectric 170 is different fromthe structure of first inner dielectric 160.

Using a combination of first inner base 162, first inner outer-facingadhesive 164, and first inner inner-facing adhesive 166 allows forming afirst inner dielectric 160 that is thinner and, more specifically,tailoring properties of individual components of first inner dielectric160. For example, first inner outer-facing adhesive 164 and first innerinner-facing adhesive 166 may easily flow during lamination filling thevoids between conductive elements of flexible hybrid interconnectcircuit 100. Briefly referring to FIG. 2A, first inner dielectric 160directly interfaces second inner dielectric 170 between signal line 132and first shield 134, and some degree of flow and gap filling may berequired. Furthermore, the presence of first inner base 162 and secondinner base 172 may provide a degree of mechanical toughness to ensurethat third shield 138 and fourth shield 139 do not undesirably punchthrough first inner dielectric layer 160 and second inner dielectriclayer 170, leading to an electrical short to signal line 132. In someexamples, first inner outer-facing adhesive 164 directly interfacesthird shield 138. Furthermore, first inner inner-facing adhesive 166directly interfaces signal line 132.

The presence of inner base layers also affects the HF performance offlexible hybrid interconnect circuit 100 (e.g., decreasing thecapacitance and signal absorption). However, inner base layers providerobust separation and reduce the risk of mechanical “punch through” ofthe inner dielectric layers. In some examples, the thick innerdielectric layers made from XLPE are used.

In the example shown in FIG. 2D, first outer dielectric 110 comprisesfirst outer base 112 and first outer adhesive 114. Similarly, secondouter dielectric 120 comprises second outer base 122 and second outeradhesive 124. First outer base 112 may be polyethylene terephthalate(PET), polyimide (PI), polyethylene naphthalate (PEN),polytetrafluoroethylene (PTFE), polyether ether ketone (PEEK) or anyother flexible insulating material. First outer adhesive 114 maycomprise an adhesive material including but not limited to XDPE,low-density polyethylene (LDPE), polyester (PET), acrylic, ethyl vinylacetate (EVA), epoxy, pressure sensitive adhesives, or the like.

Examples of Interconnecting within Stack

In some examples, one or more conductive elements of flexible hybridinterconnect circuit 100 are electrically connected. For example, one orall shields surrounding signal line 132 may be interconnected, e.g., toavoid a “floating” shield problem. These electrical connections may beformed using portions of these conductive elements or some additionalconductive elements, e.g., interconnecting vias, interconnecting plugs,or tabs. FIGS. 4A-4E illustrate different examples and stages ofinterconnecting first conductive element 350, second conductive element360, and third conductive element 370 using interconnecting via 310.Each of first conductive element 350, second conductive element 360, andthird conductive element 370 may represent any one of the shields,signal lines, and/or power conductors discussed above with reference toFIG. 2A and other figures.

Specifically, FIG. 4A illustrates a stack formed by first conductiveelement 350, second conductive element 360, and third conductive element370 before forming any electrical connections. These shields aredisposed between first outer dielectric 110 and second outer dielectric120 prior to forming any connections. FIG. 4B illustrates this stackafter forming optional opening 300 through first outer dielectric 110,first conductive element 350, and second conductive element 360. Opening300 may be formed using, for example, an etching process or any othersuitable process. Opening 300 provides access to all three shieldsallowing for interconnecting all three and, in some examples, formingexternal connections extending past first outer dielectric 110.

FIG. 4C illustrates the same stack with interconnecting via 310extending through first outer dielectric 110, first conductive element350, and second conductive element 360 and contacting third conductiveelement 370. Interconnecting via 310 is formed from a conductivematerial, such as copper or any other suitable material. Interconnectingvia 310 directly contacts first conductive element 350, secondconductive element 360, and third conductive element 370, therebyinterconnecting these shields. Furthermore, in this example,interconnecting via 310 extends outside of first outer dielectric 110,which allows forming an external electrical connection tointerconnecting via 310 and to first conductive element 350, secondconductive element 360, and third conductive element 370. For example,first conductive element 350, second conductive element 360, and thirdconductive element 370 may be externally grounded throughinterconnecting via 310. In some examples, interconnecting via 310comprises a plated element, a solder joint, a metal rivet, or a metalcrimp terminal allowing forming an external connection tointerconnecting via 310.

FIG. 4D illustrates another example of interconnecting via 310, whichalso directly contacts first conductive element 350, second conductiveelement 360, and third conductive element 370, thereby interconnectingthese shields. However, in this example, interconnecting via 310 doesnot extend through first outer dielectric 110. Instead, insulating plug320 may be used to fill the portion of the opening extending throughfirst outer dielectric 110. In some examples, interconnecting via 310may be installed prior to laminating first outer dielectric 110 to thestack such that first outer dielectric 110 does not need an opening forinstalling interconnecting via 310 and insulating plug 320 is notinstalled.

In some examples, an external connection is needed to a conductiveelement that is blocked by other one or more conductive elements, whichshould not be connected to this blocked conductive element. FIG. 4Eillustrates such an example where interconnecting via 310 is connectedto third conductive element 370 but not to first conductive element 350and second conductive element 360. Yet, interconnecting via 310protrudes through first conductive element 350 and second conductiveelement 360 such that connection to third conductive element 370 isavailable externally, past first outer dielectric 110. In this example,insulating plug 320 forms a shell around side walls of interconnectingvia 310 and insulates interconnecting via 310 from first conductiveelement 350 and second conductive element 360, through whichinterconnecting via 310 protrudes.

While the above examples described interconnections between firstconductive element 350, second conductive element 360, and thirdconductive element 370 or making a connection to one or more of theseshields, one having ordinary skill in the art would understand thatthese connection aspects can be applied to any conductive elements offlexible hybrid interconnect circuit 100.

FIGS. 4F-4I illustrate additional examples of forming electricalconnections to conductive elements in a stack of a flexible hybridinterconnect circuit. The stack shown in FIG. 4F is similar to the onedescribed above with reference to FIG. 4A but it does not include firstouter dielectric 110 and second outer dielectric 120. First outerdielectric 110 and second outer dielectric 120 are added later, e.g.,after interconnecting the conductive elements of the stack, as furtherdescribed below with reference to FIG. 4I. With this approach, firstouter dielectric 110 and second outer dielectric 120 also insulateinterconnecting via 310 and do not have openings.

Specifically, the stack shown in FIG. 4F comprises first conductiveelement 350, second conductive element 360, and third conductive element370, which may represent shields, signal lines, and/or power conductors,discussed above with reference to FIG. 2A and other figures. Firstconductive element 350, second conductive element 360, and thirdconductive element 370 are supported (e.g., with respect to each otherand other components of the flexible hybrid interconnect circuit) withinner dielectric 165. Furthermore, inner dielectric 165 may alsoelectrically isolate first conductive element 350, second conductiveelement 360, and third conductive element 370 from each other (at leastat this processing stage) and, at least partially, from the environment.

FIG. 4G illustrates the stack after forming opening 300 through firstconductive element 350, second conductive element 360, and thirdconductive element 370, and inner dielectric 165. In this example,opening 300 is a through hole, which may be easier to form than a blindhole, described above with reference to FIG. 4B. Opening 300 may beformed using, for example, an etching process or any other suitableprocess. Opening 300 provides access to all three shields allowing forinterconnecting these shields.

FIG. 4H illustrates a processing stage, after interconnecting via 310has been added into opening 300. Interconnecting via 310 directlycontacts first conductive element 350, second conductive element 360,and third conductive element 370, thereby interconnecting all threeelements. Interconnecting via 310 may comprise a plated element, aconductive adhesive, a solder joint, a metal rivet, or a metal crimpterminal allowing forming an external connection to interconnecting via310.

In some example, a portion of opening 300 may be filled with anon-conductive element (e.g., an insulator plug), while the rest ofopening 300 is filled with interconnecting via 310. This alternativeapproach allows interconnecting fewer than all conductive elements inthe stack. For example, first conductive element 350 and secondconductive element 360 may be interconnected, but remain insulated fromthird conductive element 370 after interconnecting via 310 is installedinto opening 300. Likewise, third conductive element 370 and secondconductive element 360 may be interconnected, but remain insulated fromfirst conductive element 350.

FIG. 4I illustrates the stack with first outer dielectric 110 and secondouter dielectric 120. These outer dielectrics are added afterinterconnecting first conductive element 350, second conductive element360, and third conductive element 370. In this example, first outerdielectric 110 and second outer dielectric 120 extend over innerdielectric 165 and interconnecting via 310. More specifically, firstouter dielectric 110 and second outer dielectric 120 isolate(electrically and mechanically) interconnecting via 310 from theenvironment.

FIG. 5A illustrates an example of flexible hybrid interconnect circuit100, having first conductive element 350 and third conductive element370 connected using interconnecting jumper 330, which may be referred toas an external interconnecting jumper. In this example, interconnectingjumper 330 loops around edge 102 of the stack. Second conductive element360 as well as first outer dielectric 110 and second outer dielectric120 may be positioned away from edge 102 and from interconnecting jumper330, thereby maintaining electrical insulation from interconnectingjumper 330, first conductive element 350, and third conductive element370.

FIG. 5B illustrates another example of flexible hybrid interconnectcircuit 100 in which second conductive element 360 is connected to thirdconductive element 370 using interconnecting jumper 330. In thisexample, first conductive element 350 and first outer dielectric 110have opening 300 allowing interconnecting jumper 330 to reach secondconductive element 360. In some embodiments, once the connection ismade, opening 300 is filled with an insulating material, e.g., to sealopening 300 and provide insulation between interconnecting jumper 330and first conductive element 350.

FIG. 6A illustrates an example of flexible hybrid interconnect circuit100, in which first conductive element 350 and second conductive element360, positioned at different conductive levels of the stack, areconnected directly. In this example, first inner dielectric 160comprises dielectric opening 168 allowing first conductive element 350to extend into and make contact with second conductive element 360. Thisconnection may be made using one of the connection means describedabove, or may be welded, e.g., using laser, ultrasonic, or resistivewelding.

FIG. 6B illustrates another example of flexible hybrid interconnectcircuit 100, in which first conductive element 350 and second conductiveelement 360 are connected. Similar to the example of FIG. 6A, this typeof connection may be referred to as an internal connection, since thisconnection does not protrude outside of outer dielectric layers.Referring to FIG. 6B, the connection is formed using interconnectingjumper 330, which protrudes through dielectric opening 168 in firstinner dielectric 160. The interconnected conductive elements arepositioned at different conductive layers. However, one having ordinaryskill in the art would understand that such connections may beimplemented between conductive elements positioned at the same level.

FIG. 7 illustrates another example of flexible hybrid interconnectcircuit 100, in which dielectric opening 168 in first inner dielectric160 provides access for making a connection to first conductive element350. In some examples, not shown, the same dielectric opening mayprovide access to multiple conductive components, positioned at the sameor different conductive levels.

Shield Examples

An electromagnetic shield formed by conductive elements of flexiblehybrid interconnect circuit 100 reduces and ultimately prevents lowfrequency interference and radio frequency interference during operationof flexible hybrid interconnect circuit 100. FIG. 8A illustrates across-sectional view of signal transmission portion 130 of flexiblehybrid interconnect circuit 100. In this example, the electromagneticshield is formed by first shield 134, second shield 136, third shield138, and fourth shield 139. The electromagnetic shield partiallyencloses signal line 132 in this cross-sectional view. In other words,low and radio frequency interference to and from signal line 132 ismitigated by the electromagnetic shield within this cross-section (theX-Y plane).

In this example, the same electromagnetic shield also enclosesadditional signal line 133. This configuration may be used to create adifferential signal pair, for example, which is well known for itsability to minimize electro-magnetic (EM) coupling and radiation. Ingeneral, any number of signal lines may share the same overall shield.In some embodiments, an additional shield may be positioned between twosignal lines.

Referring to FIG. 8A, each of first shield 134 and second shield 136 isdisposed between third shield 138 and fourth shield 139 along thethickness of flexible hybrid interconnect circuit 100 (the Y directionin FIG. 2A). In other words, the projection of each of first shield 134and second shield 136, along the thickness, fully or partially overlapswith each of third shield 138 and second shield 139.

Alternatively, referring to FIG. 8B, first shield 134 and second shield136 may be offset relative to third shield 138 and fourth shield 139along the width of flexible hybrid interconnect circuit 100 (the Xdirection in FIG. 2A). In this example, the projections of first shield134 and second shield 136, along the thickness, do not overlap witheither third shield 138 or second shield 139.

In still other examples, first shield 134 and second shield 136 may notbe present. The gap between third shield 138 and fourth shield 139 maybe sufficiently small to provide sufficient shielding to signal line 132positioned between third shield 138 and fourth shield 139.

The capacitance of signal transmission portion 130 is a function of thesurface area between signal line 132 and surrounding shields. Decreasingthe surface area of the shields in appropriate locations decreases thecapacitance and increases the impedance. The impedance is a square rootof the inductance divided by the capacitance. Matching the impedance offlexible hybrid interconnect circuit 100 with a receiving componentavoids sending reflected waves back down signal line 132. For example, asingle signal line may have an impedance of 50 Ohm, while a differentialpair may have a differential impedance of 100-120 Ohm.

FIGS. 8A and 8B illustrate continuous shields without openings. In somealternative examples, one or more shields may have openings to changevarious characteristics of flexible hybrid interconnect circuit 100 or,more specifically, of signal transmission portion 130. Referring toFIGS. 9A and 9B, third shield 138 comprises an opening, having the sizeless than 1/10 the wavelength of the EM wave being transmitted down thesignal line. In general, the size of openings in shields is less thanthe wavelengths of the signal carried by signal line 132 as well aswavelengths of potential external noise (blocking to preventcross-talk).

Examples of Folding Flexible Hybrid Interconnect Circuits

Flexible hybrid interconnect circuit 100 may be used for transmission ofsignals and electrical power between two distant locations. In someexamples, the distance between two ends of flexible hybrid interconnectcircuit 100 may be at least 1 meter or even at least 2 meters, eventhough the width may be relatively small, e.g., less than 100millimeters and even less than 50 millimeters. At the same time, eachconductive layer of flexible hybrid interconnect circuit 100 may befabricated from a separate metal foil sheet. To minimize materialconsumption and reduce waste, the manufacturing footprint of flexiblehybrid interconnect circuit 100 may be smaller than its operatingfootprint. The flexibility characteristic of flexible hybridinterconnect circuit 100 may be used to change its shape and positionafter its manufacturing and/or during its manufacturing. For example,flexible hybrid interconnect circuit 100 may be manufactured in a foldedstate as, for example, shown in FIG. 10A. The distance between the twoends and the overall length (L₁) of flexible hybrid interconnect circuit100 in the folded state may be relatively small. FIG. 10B is a schematicillustration of the same flexible hybrid interconnect circuit 100 in apartially unfolded state, showing that the distance between the two endsand the length of flexible hybrid interconnect circuit 100 hassubstantially increased. One having ordinary skill in the art wouldunderstand that various folding patterns are within the scope.

FIG. 10C illustrates flexible hybrid interconnect circuit 100 comprisingopenings 143 a-143 c that divide flexible hybrid interconnect circuit100 into four strips 145 a-145 d. In some examples, each strip includesone or more conductive elements 350. FIG. 10D illustrates one end offlexible hybrid interconnect circuit 100 turned 90° relative to theother end within the X-Y plane, which may be referred to as an in-planebending. Openings 143 a-143 c allow flexible hybrid interconnect circuit100 to turn and bend without significant out of plane distortions ofindividual strips 145 a-145 d. One having ordinary skills in the artwould understand that such bending would be difficult without openings143 a-143 c because of the flat profile of flexible hybrid interconnectcircuit 100 (small thickness in the Z direction) and the relatively lowin-plane flexibility of materials forming flexible hybrid interconnectcircuit 100. Adding openings 143 a-143 c allows different routing ofeach of strips 145 a-145 d, thereby increasing flexibility anddecreasing the out of plane distortion. Furthermore, selecting aparticular width and length of each opening allows for specific routingand orientation of each strip and flexible hybrid interconnect circuit100. FIGS. 10E and 10F represent cross-sections of strips 145 a-145 d atdifferent locations of flexible hybrid interconnect circuit 100. Asshown in these figures, strips 145 a-145 d may be brought closertogether and rotated 90° around each of their respective center axes atsome point (B-B) in the bend. To achieve this type of orientation, thelength of each opening may be different or staggered as, for example,shown in FIG. 10C.

FIG. 10G illustrates an example of production assembly 800 of multipleflexible hybrid interconnect circuits 100 a-100 c. In some examples,flexible hybrid interconnect circuits 100 a-100 c are partiallyintegrated, e.g., supported on the same releasable line or have onemonolithic outer dielectric layer, which is partially cut (e.g.,scored). This partial integration feature allows keeping flexible hybridinterconnect circuits 100 a-100 c together during fabrication andstorage, e.g., up to the final use of flexible hybrid interconnectcircuits 100 a-100 c.

Furthermore, in this example, flexible hybrid interconnect circuits 100a-100 c are formed in a linear form, e.g., to reduce material waste andstreamline processing. Each of flexible hybrid interconnect circuits 100a-100 c is separable from assembly 800 and is foldable into itsoperating shape, as for example, described above with reference to FIGS.10C-10F.

FIG. 10H illustrates an example of interconnect assembly 900 comprisingflexible hybrid interconnect circuits 100 a-100 c and interconnect hub910. In some examples, each of flexible hybrid interconnect circuits 100a-100 c is manufactured in a linear form as, for example, describedabove with reference to FIG. 10G. The bends in flexible hybridinterconnect circuits 100 a-100 c are formed during installation offlexible hybrid interconnect circuits 100 a-100 c (e.g., lamination of asupporting structure such as a car panel). Interconnect hub 910 formselectrical connections between individual conductive elements inflexible hybrid interconnect circuits 100 a-100 c. These electricalconnections are provided by conductive elements of interconnect hub 910positioned on one level or multiple levels (e.g., for cross-overconnections). Furthermore, the conductive elements of interconnect hub910 and the conductive elements of flexible hybrid interconnect circuits100 a-100 c are either within the same plane or in different planes.

Specifically, FIG. 10I is an example of interconnect assembly 900 priorto attaching interconnect hub 910 to flexible hybrid interconnectcircuits 100 a-100 c. Interconnect hub 910 comprises dielectric layer920 and conductive elements 915, which are partially insulated bydielectric layer 920. Furthermore, dielectric layer 920 comprisesopenings 925, partially exposing conductive elements 915 of interconnecthub 910 as shown in FIG. 10I. Conductive elements 915 and openings 925are patterned according to desired connections between flexible hybridinterconnect circuits 100 a-100 c. The example of interconnect hub 910shown in FIG. 10I is designed for interconnecting all left-mostconductive elements of flexible hybrid interconnect circuits 100 a-100c, separately interconnecting all middle conductive elements of flexiblehybrid interconnect circuits 100 a-100 c, and separately interconnectingall right-most conductive elements of flexible hybrid interconnectcircuits 100 a-100 c. FIG. 10J shows interconnect assembly 900 of FIG.10I after attaching interconnect hub 910 to flexible hybrid interconnectcircuits 100 a-100 c.

FIG. 10K illustrates a side cross-sectional view of interconnectassembly 900 comprising interconnect hub 910, mounted to body panel 210and connected to flexible hybrid interconnect circuit 100, in accordancewith some examples. Specifically, interconnect hub 910 is mounted tobody panel 210 using hub mounting adhesive 921, such as an adhesive tapeor, more specifically, a very high bonding (VHB) tape or an ultra-highbonding (UHB) tape. In some examples, hub mounting adhesive 921comprises a polyethylene liner and an acrylic adhesive, disposed on theliner. Other materials are also within the scope.

Interconnect assembly 900 also comprises hub cover plate 930, which ismounted to interconnect hub 910 using plate mounting adhesive 922. Insome examples, plate mounting adhesive 922 is the same as hub mountingadhesive 921. Alternatively, plate mounting adhesive 922 is differentfrom hub mounting adhesive 921. For example, plate mounting adhesive 922is as an adhesive tape or, more specifically, very high bonding (VHB)tape or ultra-high bonding (UHB) tape. In some examples, plate mountingadhesive 922 comprises a polyethylene liner and an acrylic adhesivedisposed on the liner. Other materials are also within the scope.

Hub cover plate 930 provides mechanical support and strain relief toelectrical connections between interconnect hub 910 and interconnectcircuit 100. In some examples, plate mounting adhesive 922 is in directcontact with interconnect circuit 100 or, more specifically, withconductive elements of interconnect circuit 100. As such, any strainapplied between interconnect hub 910 and interconnect circuit 100 istransferred by plate mounting adhesive 922 to hub cover plate 930,thereby reducing the strain on the electrical connections betweeninterconnect hub 910 and interconnect circuit 100. In some examples, hubcover plate 930 is formed from a rigid plastic, a composite material(e.g., glass-reinforced epoxy laminate), or the like.

Examples of Conductive Tabs and Forming Electrical Connections

Referring to FIGS. 11A-11C, external connections to conductive elementsarranged into a stack and/or connections between these conductiveelements may be formed using tabs of these elements that protrude awayfrom boundaries (edges) of the stack. Specifically, FIG. 11A is aschematic perspective view of flexible hybrid interconnect circuit 100comprising first conductive element 350, second conductive element 360,and third conductive element 370, forming a stack along the thickness offlexible hybrid interconnect circuit 100. Each of first conductiveelement 350, second conductive element 360, and third conductive element370 may represent any one of the shields, signal lines, and/or powerconductors discussed above with reference to FIG. 2A and other figures.

Referring to FIG. 11A, first conductive element 350 comprises first tab352, second conductive element 360 comprises second tab 362, and thirdconductive element 370 comprises third tab 372. Each of first tab 352,second tab 362, and third tab 372 extends along the length of flexiblehybrid interconnect circuit 100 and outside of the stack boundaries.FIG. 11B is a schematic top view of another example of flexible hybridinterconnect circuit 100, in which first tab 352 and third tab 372 alsoflare of along the width of flexible hybrid interconnect circuit 100 toprovide more spacing among these tabs. FIG. 11C is a schematic top viewof yet another example of flexible hybrid interconnect circuit 100, inwhich first tab 352, second tab 362, and third tab 372 extend along thewidth of flexible hybrid interconnect circuit 100 and outside of thestack boundaries. In this example, first tab 352, second tab 362, andthird tab 372 are also offset along the length of flexible hybridinterconnect circuit 100.

FIG. 11D is a schematic top view of two flexible hybrid interconnectcircuits 100 a and 100 b, showing their orientation during production.The dashed line represents the footprint of both circuits, whichcorresponds to the material for each layer. This orientation of twoflexible hybrid interconnect circuits 100 a and 100 b allows minimizingmaterial waste, while forming multiple flexible hybrid interconnectcircuits in parallel.

FIG. 11E and FIG. 11F are schematic top views of conductive element 350,comprising first conductive element portion 351, second conductiveelement portion 353, and transition portion 355, in accordance with someexamples. Specifically, FIG. 11F is an expanded view of a part ofconductive element 350 around transition portion 355. Transition portion355 is monolithic with and interconnects first conductive elementportion 351 and second conductive element portion 353. At the same time,transition portion 355 has a narrower width (W_(TP)) than the width(W_(CE)) of either first conductive element portion 351 or secondconductive element portion 353, which may be collectively referred to asthe conductive element width (W_(EE)). In some examples, firstconductive element portion 351 and second conductive element portion 353have the same width (W_(CE)). Furthermore, first conductive elementportion 351 and second conductive element portion 353 are offsetrelative to each as shown in FIG. 11E and FIG. 11F.

In some examples, transition portion 355 is operable as an electricalfuse, protecting other conductive components of flexible hybridinterconnect circuit 100 and components to which flexible hybridinterconnect circuit 100 is connected to. The fusing characteristics oftransition portion 355 depend on its width (W_(TP)) and its length(L_(TP)). The width (W_(TP)) of transition portion 355, in turn, dependson the offset and the width (W_(CE)) of either first conductive elementportion 351 or second conductive element portion 353 (e.g.,W_(TP)=W_(CE)−Offset). In some examples, the width (W_(TP)) oftransition portion 355 is between 5% and 50% of the conductive elementwidth (W_(CE)) or, more specifically, between 10% and 30% of theconductive element width (W_(CE)). The length (L_(TP)) of transitionportion 355 may be between 10 micrometers and 700 micrometers or, morespecifically, between 50 micrometers and 500 micrometers or even between100 micrometers and 400 micrometers.

FIG. 12A is a schematic side view of flexible hybrid interconnectcircuit 100, in which first tab 352 and third tab 372 flare in thedirection of the thickness of flexible hybrid interconnect circuit 100to provide more spacing among the tabs. It should be noted that thisexample can be combined with any other examples described above withreference to FIGS. 7A-7C.

FIG. 12B is a side schematic view of flexible hybrid interconnectcircuit 100, showing third tab 372 making a direct electrical connectionto first conductive element 350. FIG. 12C is a side schematic view offlexible hybrid interconnect circuit 100, showing third tab 372 making adirect electrical connection to second tab 362.

Processing Examples

FIG. 13A is a process flowchart corresponding to method 1340 oflaminating patterned conductive sheets to inner and outer dielectrics.Method 1340 may involve applying inner dielectrics to patternedconductive sheets (block 1342). More specifically, an inner dielectricis applied to a portion of at least one conductive sheet, while anotherportion remains exposed and free from the inner dielectric. FIG. 13B isa schematic illustration of first inner dielectric 160 applied to aportion of first conductive element 350 with first inner dielectric 160and, separately, second inner dielectric 170 applied to a portion ofsecond conductive element 360 with first inner dielectric 160. In thisexample, first conductive element 350 is a part of one patternedconductive sheet, while second conductive element 360 is a part of adifferent patterned conductive sheet. In some examples, only oneconductive element receives an inner dielectric, while anotherconductive element remains free from any inner dielectrics.

Referring to FIG. 13A, method 1340 proceeds with laminating the innerdielectrics, previously applied to the patterned conductive sheets, toeach other (block 1344). FIG. 13C is a schematic illustration of firstinner dielectric 160 laminated to second inner dielectric 170. Portionsof first conductive element 350 and second conductive element 360, whichare free from inner dielectrics, are aligned, which allows forming adirect contact between these portions in the future operations. Whenonly one patterned conductive sheet has an applied inner dielectric,this inner dielectric is laminated directly to another patternedconductive sheet.

Referring to FIG. 13A, method 1340 proceeds with interconnecting thepatterned conductive sheets to each other (block 1346). After thisoperation, the patterned conductive sheets or, more specifically,individual conductive elements of the patterned conductive sheets areelectrically connected. FIG. 13D is a schematic illustration of firstconductive element 350 and second conductive element 360 connected toeach other. This connection may involve welding, soldering, mechanicalcrimping, forming a conductive adhesive bonds, and the like.

Referring to FIG. 13A, method 1340 proceeds with laminating outerdielectrics (block 1348). The outer dielectrics are laminated to a stackcomprising one or more inner dielectrics and two or more patternedconductive sheets, connected to each other. This operation also involvesredistribution of the inner dielectrics to fill various voids withinthis assembly. FIG. 13E is a schematic illustration of this assemblyshowing first outer dielectric 110 and second outer dielectric 120laminated to first inner dielectric 160, first conductive element 350,second conductive element 360, and second inner dielectric 170.

Programmable Interconnect Hub Examples

FIGS. 14A and 14B illustrate interconnect assembly 900 at two differentoperating stages. Interconnect assembly 900 comprises first interconnectcircuit 100 a and second interconnect circuit 100 b, coupled tointerconnect hub 910, which is programmable. For example, interconnecthub 910 may comprise a field programmable gate array (FPGA), acontroller, a computer chip, or the like. A programmable interconnecthub allows changing connections within interconnect assembly 900 (e.g.,between first interconnect circuit 100 a and second interconnect circuit100 b), thereby providing additional configurations and ultimately usingthe same interconnect assembly for different types of connections andapplications (aka “one size fits all” approach). For example,interconnect assembly 900 may be a wire harness for a vehicle. The sameinterconnect assembly 900 may be used for different configurations ofthe vehicle with programming of interconnect hub 910 addressingdifferences in configurations or, more specifically, differentelectrical and signal connections needed as a result of theseconfiguration differences.

In some examples, interconnect hub 910 is programmed to connect power,ground, and data traces from the in-line to the various modules. As themodules are changed from one vehicle model to another, interconnect hub910 is reprogrammed to change the output definition of interconnect hub910, but the same interconnect hub 910 can be used across the entirevehicle fleet, despite differences in model configurations.

Furthermore, interconnect hub 910 may be programmed to provide a remotedisconnect feature. For example, if a conductive element of the circuitstops working (e.g., due to a short, break, or other reason), the faultyconductive element may be disconnected at interconnect hub 910. Adifferent line may be selected by interconnect hub 910 to perform thefunction of the faulty conductive element. Finally, interconnect hub 910may be reprogrammed during its use (e.g., changing from one operation toanother and so on).

Referring to FIGS. 14A and 14B, first interconnect circuit 100 acomprises first conductive element 350 a and second conductive element350 b. Second interconnect circuit 100 b comprises third conductiveelement 350 c and fourth conductive element 350 d. In this simplifiedexample, interconnect hub 910 is programmable allowing to changeconnections among first conductive element 350 a, second conductiveelement 350 b, third conductive element 350 c, and fourth conductiveelement 350 d. FIG. 14A illustrates an operating stage, whereinterconnect hub 910 connects first conductive element 350 a of firstinterconnect circuit 100 a with third conductive element 350 c of secondconductive element 350 b, and separately, second conductive element 350b of first interconnect circuit 100 a with fourth conductive element 350d of second conductive element 350 b. FIG. 14B illustrates a differentoperating stage, where interconnect hub 910 connects first conductiveelement 350 a of first interconnect circuit 100 a with fourth conductiveelement 350 d of second conductive element 350 b, and separately, secondconductive element 350 b of first interconnect circuit 100 a with thirdconductive element 350 c of second conductive element 350 b.Interconnect hub 910 may be programmed to switch between these operatingstages. In some examples, one or more of the conductive elementsconnected to interconnect hub 910 may be used for programminginterconnect hub 910. In other words, programming of interconnect hub910 may be performed through interconnect assembly 900.

While FIGS. 14A and 14B illustrate an example where connections betweenconductive elements of two interconnect circuits are simply flipped, onehaving ordinary skill in the art would understand that any otherprogrammable connections are possible with this design. For example,conductive elements of the same interconnect circuit may be connected ordisconnected, additional interconnect circuits may be connected tointerconnect hub 910, and so on. For example, FIG. 14C illustrates anexample of interconnect assembly 900 comprising interconnect hub 910,connected to flexible hybrid interconnect circuits 100 a-100 c andtwisted pair cable 100 d. It should be noted that interconnect circuits100 a-100 c described above provide various advantages in signaltransmission, in comparison to conventional twisted pair cables. Inparticular, an interconnect circuit has much better impedance controldue to the fixed position between its conductive elements, while thedistance between wires in a twisted pair cable can vary substantially.

CONCLUSION

Although the foregoing concepts have been described in some detail forpurposes of clarity of understanding, it will be apparent that certainchanges and modifications may be practiced within the scope of theappended claims. It should be noted that there are many alternative waysof implementing the processes, systems, and apparatuses. Accordingly,the present examples are to be considered as illustrative and notrestrictive.

What is claimed is:
 1. A flexible hybrid interconnect circuit comprising: a first strip; a second strip; a third strip, such that the first strip is positioned between the second strip and the third strip; a first circuit opening, disposed between and partially separates the first strip and the second strip; a second circuit opening, disposed between and partially separates the first strip and the third strip, wherein the first circuit opening and the second circuit opening are configured for in-plane bending of the flexible hybrid interconnect circuit, and wherein the first circuit opening and the second circuit opening have different lengths and at least partially overlap with each other along a length of the flexible hybrid interconnect circuit; a first outer dielectric, comprising first dielectric openings, corresponding to the first circuit opening and the second circuit opening; a second outer dielectric, comprising second dielectric openings, corresponding to the first circuit opening and the second circuit opening; a signal transmission portion, disposed between the first outer dielectric and the second outer dielectric and comprising a first signal line, disposed within the first strip and between the first circuit opening and the second circuit opening; and a power transmission portion, disposed between the first outer dielectric and the second outer dielectric and offset relative to the signal transmission portion along a width of the flexible hybrid interconnect circuit.
 2. The flexible hybrid interconnect circuit of claim 1, wherein the signal transmission portion further comprises a first shield, offset relative to the first signal line along a thickness of the flexible hybrid interconnect circuit.
 3. The flexible hybrid interconnect circuit of claim 2, wherein the first shield of the signal transmission portion comprises a first shield opening, partially overlapping with the first circuit opening.
 4. The flexible hybrid interconnect circuit of claim 3, wherein the first shield of the signal transmission portion comprises a first additional shield opening, partially overlapping the second circuit opening.
 5. The flexible hybrid interconnect circuit of claim 2, wherein the signal transmission portion further comprises a second shield, offset relative to the first signal line along a thickness of the flexible hybrid interconnect circuit such that the first signal line is positioned between the first shield and the second shield.
 6. The flexible hybrid interconnect circuit of claim 5, wherein the second shield of the signal transmission portion comprises a second shield opening, partially overlapping with the first circuit opening.
 7. The flexible hybrid interconnect circuit of claim 5, wherein the signal transmission portion further comprises a third shield and a fourth shield, wherein the first signal line is disposed between the third shield and the fourth shield along a width of the flexible hybrid interconnect circuit.
 8. The flexible hybrid interconnect circuit of claim 7, wherein the third shield and the fourth shield are disposed within the first strip and between the first circuit opening and the second circuit opening.
 9. The flexible hybrid interconnect circuit of claim 7, wherein each of the third shield and the third shield is disposed between the first shield and the second shield along the thickness of the flexible hybrid interconnect circuit.
 10. The flexible hybrid interconnect circuit of claim 2, wherein the first signal line is electrically insulated from the first shield.
 11. The flexible hybrid interconnect circuit of claim 1, further comprising: a first inner dielectric, disposed between the first signal line and the first outer dielectric; and a second inner dielectric, disposed between the first signal line and the second outer dielectric.
 12. The flexible hybrid interconnect circuit of claim 11, wherein at least one of the first inner dielectric and the second inner dielectric comprises crosslinked low density polyethylene (LDPE).
 13. The flexible hybrid interconnect circuit of claim 11, wherein at least one the first inner dielectric or the second inner dielectric comprises a flame retardant.
 14. The flexible hybrid interconnect circuit of claim 1, further comprising: an interconnect hub, connected to the first signal line; and a second signal line, connected to the interconnect hub, wherein the interconnect hub is configured to selective connect and disconnect the first signal line and the second signal line.
 15. The flexible hybrid interconnect circuit of claim 14, further comprising a third signal line, connected to the interconnect hub, wherein the interconnect hub is configured to selective connect and disconnect the first signal line and either one of the second signal line or the third signal line.
 16. The flexible hybrid interconnect circuit of claim 15, wherein the interconnect hub is remotely controlled using one of the first signal line, the second signal line, or the third signal line.
 17. The flexible hybrid interconnect circuit of claim 14, wherein the interconnect hub is one of a field programmable gate array (FPGA), a controller, or a computer chip.
 18. The flexible hybrid interconnect circuit of claim 14, wherein the second signal line is disposed in one of the second strip or the third strip. 